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News

EE Times Asia
eetasia.com > db-hitek-qualifies-1200v-sic-mosfet-process-on-8in-wafers

DB HiTek Qualifies 1,200V SiC MOSFET Process on 8in Wafers

1+ day, 5+ hour ago   (287+ words) Home » Semiconductor » DB HiTek Qualifies 1,200V SiC MOSFET Process on 8in Wafers DB HiTek targets 2027 volume production as it advances 8-inch SiC process technology. DB HiTek has completed reliability qualification for its 1,200V silicon carbide (SiC) MOSFET process on 8-inch (200mm) wafers, advancing the…...

EE Times Asia
eetasia.com > silicon-motion-now-certified-to-iso-sae-21434-standards

Silicon Motion Now Certified to ISO/SAE 21434 Standards

4+ day, 13+ hour ago   (261+ words) EE Times Asia Home » Automotive » Silicon Motion Now Certified to ISO/SAE 21434 Standards Silicon Motion's certification to ISO/SAE 21434 validates cybersecurity processes supporting secure automotive storage development. Silicon Motion Technology has earned ISO/SAE 21434:2021 Automotive Cybersecurity Process Certification from SGS-TÜV…...

EE Times Asia
eetasia.com > synopsys-astar-ime-target-simulation-led-advanced-packaging-development

Synopsys, A*STAR IME Target Simulation-led Advanced Packaging Development

4+ day, 14+ hour ago   (229+ words) Advanced packaging is becoming a central part of semiconductor system design as AI and high-performance computing drive demand for chiplet-based and heterogeneous architectures. As package complexity increases, however, designers face a growing range of mechanical, thermal and reliability issues that…...

EE Times Asia
eetasia.com > semi-silicon-catalyst-ink-partnership-to-accelerate-global-semiconductor-innovation

SEMI, Silicon Catalyst Ink Partnership to Accelerate Global Semiconductor Innovation

1+ week, 4+ day ago   (186+ words) Home » Semiconductor » SEMI, Silicon Catalyst Ink Partnership to Accelerate Global Semiconductor Innovation SEMI and Silicon Catalyst have signed a strategic partnership agreement aimed at accelerating innovation and strengthening connections between semiconductor hardware startups, investors, manufacturers, and technology leaders worldwide. The…...

EE Times Asia
eetasia.com > rigaku-puts-spotlight-on-advanced-packaging-metrology-at-semicon-taiwan-2026

Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026

2+ week, 5+ hour ago   (256+ words) Home » Test & Measurement » Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026 Rigaku will showcase X-ray metrology and inspection systems targeting HBM, hybrid bonding and advanced packaging process control. The Rigaku Group will showcase its latest X-ray metrology and…...

EE Times Asia
eetasia.com > macdermid-alpha-showcases-materials-enabling-next-gen-packaging-at-semicon-taiwan-2026

MacDermid Alpha Showcases Materials Enabling Next-gen Packaging at SEMICON Taiwan 2026

2+ week, 3+ day ago   (214+ words) Home » Manufacturing » MacDermid Alpha Showcases Materials Enabling Next-gen Packaging at SEMICON Taiwan 2026 MacDermid Alpha will showcase materials for advanced interconnects, die attach and wafer-level packaging at SEMICON Taiwan. MacDermid Alpha Electronics Solutions will showcase materials and process technologies for advanced…...

EE Times Asia
eetasia.com > nxp-expands-malaysia-assembly-and-test-capacity-with-new-petaling-jaya-factory

NXP Expands Malaysia Assembly and Test Capacity with New Petaling Jaya Factory

3+ week, 3+ day ago   (364+ words) Home » Semiconductor » NXP Expands Malaysia Assembly and Test Capacity with New Petaling Jaya Factory NXP is expanding its Malaysian assembly and test operations with a 500,000-square-foot smart factory targeting production ramp in 2028. NXP Semiconductors has broken ground on a new…...

EE Times Asia
eetasia.com > from-manual-checks-to-predictive-control-the-rise-of-in-situ-sensing-in-semiconductor-fabs

From Manual Checks to Predictive Control: The Rise of In-Situ Sensing in Semiconductor Fabs

3+ week, 4+ day ago   (17+ words) EE Times Asia...

EE Times Asia
eetasia.com > manz-asia-expands-panel-level-packaging-platforms-for-advanced-rdl

Manz Asia Expands Panel-Level Packaging Platforms for Advanced RDL

3+ week, 5+ day ago   (228+ words) Home » Packaging » Manz Asia Expands Panel-Level Packaging Platforms for Advanced RDL Manz Asia expands production-proven panel platforms as AI packaging drives larger formats and denser redistribution layers. The Omni 310, Omni 510, and Omni 700 platforms combine ECD with wet-process capabilities including cleaning,…...

EE Times Asia
eetasia.com > benchmark-leverages-engineering-depth-to-drive-high-mix-manufacturing-growth-in-thailand

Benchmark Leverages Engineering Depth to Drive High-mix Manufacturing Growth in Thailand

3+ week, 5+ day ago   (672+ words) Home » Manufacturing » Benchmark Leverages Engineering Depth to Drive High-mix Manufacturing Growth in Thailand For Benchmark, Thailand is more than a production base. It has become a strategic engineering and manufacturing hub capable of supporting highly regulated industries, advanced communications, medical…...