Please confirm you are human

This browser or connection looks automated. Press and continuously hold the control for 3 seconds to enable Google-hosted web results and, when separately allowed, AI-assisted answers.

A successful check enables 100 search requests. Interactive access does not authorize scraping, systematic collection, or reuse of search output.

Hold with a pointer, or hold Space or Enter.

News

EE Times Asia
eetasia.com > trendforce-top-10-global-fabless-ic-design-firms-post-73-yoy-revenue-growth-in-2q-2026

TrendForce: Top 10 Global Fabless IC Design Firms Post 73% YoY Revenue Growth in 2Q 2026

1+ day, 4+ hour ago   (462+ words) Home » IC Design » TrendForce: Top 10 Global Fabless IC Design Firms Post 73% YoY Revenue Growth in 2Q 2026 Combined revenue of the world’s top 10 fabless IC design companies surged by 73% YoY to more than $141.45 billion in 2Q 2026. NVIDIA remained firmly in first place, while…...

EE Times Asia
eetasia.com > sk-keyfoundry-elmos-expand-partnership-with-130nm-wafer-supply-deal

SK keyfoundry, Elmos Expand Partnership with 130nm Wafer Supply Deal

4+ day, 13+ hour ago   (256+ words) Home » Semiconductor » SK keyfoundry, Elmos Expand Partnership with 130nm Wafer Supply Deal SK keyfoundry has expanded its long-running collaboration with Elmos Semiconductor SE to include its 130nm process technology, signing a long-term wafer supply agreement that will provide the automotive chipmaker with…...

EE Times Asia
eetasia.com > synopsys-astar-ime-target-simulation-led-advanced-packaging-development

Synopsys, A*STAR IME Target Simulation-led Advanced Packaging Development

4+ day, 14+ hour ago   (229+ words) Advanced packaging is becoming a central part of semiconductor system design as AI and high-performance computing drive demand for chiplet-based and heterogeneous architectures. As package complexity increases, however, designers face a growing range of mechanical, thermal and reliability issues that…...

EE Times Asia
eetasia.com > semi-global-ic-equipment-billings-up-23-yoy-in-2q-2026

SEMI: Global IC Equipment Billings Up 23% YoY in 2Q 2026

1+ week, 15+ hour ago   (129+ words) Home » Equipment » SEMI: Global IC Equipment Billings Up 23% YoY in 2Q 2026 Global semiconductor equipment billings increased by 23% year-over-year to $40.53 billion in the second quarter of 2026. Global semiconductor equipment billings increased by 23% year-over-year to $40.53 billion in the second quarter of 2026, according to…...

EE Times Asia
eetasia.com > ks-targets-ai-networking-growth-with-thermo-compression-bonding-for-cpo

K&S Targets AI Networking Growth with Thermo-Compression Bonding for CPO

1+ week, 4+ day ago   (197+ words) Home » Packaging » K&S Targets AI Networking Growth with Thermo-Compression Bonding for CPO Kulicke & Soffa Industries (K&S) is positioning its advanced packaging portfolio to support the growing adoption of co-packaged optics (CPO) in AI infrastructure, with its thermo-compression bonding (TCB)…...

EE Times Asia
eetasia.com > global-semiconductor-revenue-to-reach-1-6t-in-2026

Global Semiconductor Revenue to Reach $1.6T in 2026

1+ week, 6+ day ago   (293+ words) Home » Market News » Global Semiconductor Revenue to Reach $1.6T in 2026 Global semiconductor revenue is expected to reach $1.6 trillion in 2026 and $1.9 trillion in 2027, according to Gartner. Global semiconductor revenue is expected to reach $1.6 trillion in 2026, increasing 92% from 2025 revenue of $809 billion, according to…...

EE Times Asia
eetasia.com > kioxia-and-sandisk-plan-31b-japan-investment-to-expand-nand-capacity

Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity

2+ week, 6+ hour ago   (293+ words) Home » Memory » Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity Kioxia and Sandisk plan more than $31 billion in Japanese investments through 2032, targeting advanced NAND production and supply stability. The planned investment will support infrastructure expansion at Kioxia’s Yokkaichi…...

EE Times Asia
eetasia.com > rigaku-puts-spotlight-on-advanced-packaging-metrology-at-semicon-taiwan-2026

Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026

2+ week, 5+ hour ago   (256+ words) Home » Test & Measurement » Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026 Rigaku will showcase X-ray metrology and inspection systems targeting HBM, hybrid bonding and advanced packaging process control. The Rigaku Group will showcase its latest X-ray metrology and…...

EE Times Asia
eetasia.com > macdermid-alpha-showcases-materials-enabling-next-gen-packaging-at-semicon-taiwan-2026

MacDermid Alpha Showcases Materials Enabling Next-gen Packaging at SEMICON Taiwan 2026

2+ week, 3+ day ago   (214+ words) Home » Manufacturing » MacDermid Alpha Showcases Materials Enabling Next-gen Packaging at SEMICON Taiwan 2026 MacDermid Alpha will showcase materials for advanced interconnects, die attach and wafer-level packaging at SEMICON Taiwan. MacDermid Alpha Electronics Solutions will showcase materials and process technologies for advanced…...

EE Times Asia
eetasia.com > silicon-motion-ssd-reference-design-kit-targeted-at-ai-infra

Silicon Motion SSD Reference Design Kit Targeted at AI Infra

3+ week, 6+ day ago   (148+ words) Home » Embedded Systems » Silicon Motion SSD Reference Design Kit Targeted at AI Infra The platform enables enterprise SSDs to serve as a persistent memory layer supporting KV cache offload and autonomous AI agents. The next-generation PerformaShape technology introduces an enhanced…...