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- Aug 17, 2026earliest in window
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News
TrendForce: Top 10 Global Fabless IC Design Firms Post 73% YoY Revenue Growth in 2Q 2026
1+ day, 4+ hour ago (462+ words) Home » IC Design » TrendForce: Top 10 Global Fabless IC Design Firms Post 73% YoY Revenue Growth in 2Q 2026 Combined revenue of the world’s top 10 fabless IC design companies surged by 73% YoY to more than $141.45 billion in 2Q 2026. NVIDIA remained firmly in first place, while…...
SK keyfoundry, Elmos Expand Partnership with 130nm Wafer Supply Deal
4+ day, 13+ hour ago (256+ words) Home » Semiconductor » SK keyfoundry, Elmos Expand Partnership with 130nm Wafer Supply Deal SK keyfoundry has expanded its long-running collaboration with Elmos Semiconductor SE to include its 130nm process technology, signing a long-term wafer supply agreement that will provide the automotive chipmaker with…...
Synopsys, A*STAR IME Target Simulation-led Advanced Packaging Development
4+ day, 14+ hour ago (229+ words) Advanced packaging is becoming a central part of semiconductor system design as AI and high-performance computing drive demand for chiplet-based and heterogeneous architectures. As package complexity increases, however, designers face a growing range of mechanical, thermal and reliability issues that…...
SEMI: Global IC Equipment Billings Up 23% YoY in 2Q 2026
1+ week, 15+ hour ago (129+ words) Home » Equipment » SEMI: Global IC Equipment Billings Up 23% YoY in 2Q 2026 Global semiconductor equipment billings increased by 23% year-over-year to $40.53 billion in the second quarter of 2026. Global semiconductor equipment billings increased by 23% year-over-year to $40.53 billion in the second quarter of 2026, according to…...
K&S Targets AI Networking Growth with Thermo-Compression Bonding for CPO
1+ week, 4+ day ago (197+ words) Home » Packaging » K&S Targets AI Networking Growth with Thermo-Compression Bonding for CPO Kulicke & Soffa Industries (K&S) is positioning its advanced packaging portfolio to support the growing adoption of co-packaged optics (CPO) in AI infrastructure, with its thermo-compression bonding (TCB)…...
Global Semiconductor Revenue to Reach $1.6T in 2026
1+ week, 6+ day ago (293+ words) Home » Market News » Global Semiconductor Revenue to Reach $1.6T in 2026 Global semiconductor revenue is expected to reach $1.6 trillion in 2026 and $1.9 trillion in 2027, according to Gartner. Global semiconductor revenue is expected to reach $1.6 trillion in 2026, increasing 92% from 2025 revenue of $809 billion, according to…...
Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity
2+ week, 6+ hour ago (293+ words) Home » Memory » Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity Kioxia and Sandisk plan more than $31 billion in Japanese investments through 2032, targeting advanced NAND production and supply stability. The planned investment will support infrastructure expansion at Kioxia’s Yokkaichi…...
Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026
2+ week, 5+ hour ago (256+ words) Home » Test & Measurement » Rigaku Puts Spotlight on Advanced Packaging Metrology at SEMICON Taiwan 2026 Rigaku will showcase X-ray metrology and inspection systems targeting HBM, hybrid bonding and advanced packaging process control. The Rigaku Group will showcase its latest X-ray metrology and…...
MacDermid Alpha Showcases Materials Enabling Next-gen Packaging at SEMICON Taiwan 2026
2+ week, 3+ day ago (214+ words) Home » Manufacturing » MacDermid Alpha Showcases Materials Enabling Next-gen Packaging at SEMICON Taiwan 2026 MacDermid Alpha will showcase materials for advanced interconnects, die attach and wafer-level packaging at SEMICON Taiwan. MacDermid Alpha Electronics Solutions will showcase materials and process technologies for advanced…...
Silicon Motion SSD Reference Design Kit Targeted at AI Infra
3+ week, 6+ day ago (148+ words) Home » Embedded Systems » Silicon Motion SSD Reference Design Kit Targeted at AI Infra The platform enables enterprise SSDs to serve as a persistent memory layer supporting KV cache offload and autonomous AI agents. The next-generation PerformaShape technology introduces an enhanced…...